Waiver for another RGA scan of the OMC Breadboard Assy, ASSY-D1201439-3

Document #:

LIGO-E1400330-v1

Document type:

E - Engineering documents

Abstract:

The aLIGO OMC breadboard Assembly (D1201439-v2) for the 3rd IFO was recently cleaned and vacuum baked (ICS Bake-7446). The RGA scan associated with this vacuum bake was approved. Subsequently the EP30-2 adhesively bonded beam dump joints were found to be somewhat debonded, likely as a result of differential thermal expansion. Since debonding and rework of the OMC breadboard assy would risk damage to the OMC optics it was decided to stake the beam dumps by adding EP30-2 adhesive along their perimeter interface with the OMC breadboard. This was done and was successful; The beam dumps appear to be more firmly attached. This document is a waiver for another (second) vacuum bake and RGA scan.

Files in Document:

• E1400330-v1, Waiver for another RGA scan of the OMC Br...pdf (622.0 kB)

Topics:

• Sensing and Control
• System Engineering
• Vacuum

Authors:

• Dennis Coyne

Notes and Changes:

See also the following ICS defect record:
https://ics-redux.ligo-la.caltech.edu/JIRA/browse/DEFECT-ISC-12035
waiver granted 7/14/2014 by Dennis Coyne

Referenced by:

• LIGO-E1600180-v1: Waiver for vacuum bake and RGA scan of a bonded repair of a beam dump on the L1 OMC Breadboard Assy, ASSY-D1201439-3
• LIGO-E1500147-v1: aLIGO, Waiver Log