LIGO Document E1700332-x0
- E960022 refers to the solder for use in the UHV as Kester 6337 (Sn63Pb37) and also refers to a deflux solution. We typically deflux with isopropyl alcohol to dissolve rosin residues.
A 2 inch by 4 inch copper plate was saturated with 63/37 rosin core solder as a test of vacuum cleaning procedures; see T1200491. This sample was submitted for RGA and optical ringdown cavity testing. Jeff Lewis (1-Nov-2012 email) gave the copper plate to Bob Taylor and asked him to "clean it the same way cables we clean cables". RGA scans for this plate are filed in this DCC entry (sent by Bob Taylor in a 17-Jan-2013 email). These RGA scans look clean and acceptable.
A "clean soldering procedure", T1300040, was then written to capture the approach to creating & cleaning solder joints which are acceptable for LIGO UHV service.
Apparently this plate was not then subsequently tested in the optical contamination cavity. However, we had previously tested a solder sample in the optical contamination cavity (16-Jan-2004 email from Liyuan Zhan); see E17?
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