LIGO Document E1700332-v1

Material Qualification RGA Test Results: Kester 6337 (Sn63Pb37) Solder

Document #:
LIGO-E1700332-v1
Document type:
E - Engineering documents
Other Versions:
LIGO-E1700332-x0
21 Sep 2017, 13:40
Abstract:
E960022 refers to the solder for use in the UHV as Kester 6337 (Sn63Pb37) and also refers to a deflux solution. We typically deflux with isopropyl alcohol to dissolve rosin residues.

A 2 inch by 4 inch copper plate was saturated with 63/37 rosin core solder as a test of vacuum cleaning procedures; see T1200491. This sample was submitted for RGA and optical ringdown cavity testing. Jeff Lewis (1-Nov-2012 email) gave the copper plate to Bob Taylor and asked him to "clean it the same way cables we clean cables". RGA scans for this plate are filed in this DCC entry (sent by Bob Taylor in a 17-Jan-2013 email). These RGA scans look clean and acceptable.

In a somewhat related effort, a "clean soldering procedure", T1300040, was written to capture the approach to creating & cleaning solder joints on components which cannot be re-cleaned via the normal clean and bake process. Used judiciously, the result of this procedure can yield results acceptable for LIGO UHV service, but this process is not intended to replace or circumvent the normal clean and bake process.

Apparently this plate was not then subsequently tested in the optical contamination cavity. However, we had previously tested a solder sample in the optical contamination cavity (16-Jan-2004 email from Liyuan Zhang); see E1700333

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